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| | Contact Us In this Issue:ThermoGrip for Carton Sealing
1-800-323-5158
| Glu Guru
July 13, 2010
Journal
ADHESIVE FOCUS NEWS
JOURNAL
The
Glu Guru welcomes you to
Cost Cutting Information helpful to your
Production and Packaging needs
|  Product
Thermogrip® H1714 is a low application temperature hot melt adhesive
for case forming and sealing applications.
RIGID PACKAGING
ADHESIVE
Product Description-Thermogrip® H1714 is
specifically designed to provide very low application temperatures
(250°F to 275°F) while still providing fiber-tearing bonds over a
wide temperature range on a variety of substrates.
Basic Uses-You can have
confidence in the performance of H1714 in your process across a wide range
of conditions and materials due to:
- The Low Application Temperature Requirements of H1714-Up to
100F lower than conventional Hot melts. Cost savings in your process due to
energy savings, increased equipment longevity, and decreased risk of severe
burns by your operators.
- The Extended
Temperature Resistance of H1714-Provides fiber-tearing bonds
over a wide
temperature range on a variety of
substrates.
- The Excellent
Adhesion of H1714-Adheres well to board with a wide range of
recycled content as well as varnished, coated, and difficult
substrates.
- The Process Ease
of H1714-
- Clean running with little or no
stringing.
- Low application viscosity.
- Excellent thermal stability and resistance to
charring.
ADHESIVE PROPERTIES Viscosity at 250°F:
1375
cP Viscosity at
275°F:
850 cP Viscosity at
300°F:
550 cP Softening
Point:
164°F Specific
Gravity:
98 g/cc Suggested Running Temperature: 250°F to
300°F
For more
information and/or to place an order Call
1-800-323-5158
 VISIT OUR WEBSITE AT www.gluguru.com One Stop Source for Adhesives, Dispensers,
Accessories
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On-Hand Adhesives, Inc All rights reserved
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