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 Contact Us       In this Issue:ThermoGrip for Carton Sealing    1-800-323-5158
 Glu Guru July 13, 2010  Journal
Glu Guru NewsletterADHESIVE FOCUS NEWS JOURNAL
                    The Glu Guru welcomes you to
             Cost Cutting Information helpful to your
                Production and Packaging needs

 
Product  Thermogrip® H1714 is a low application temperature hot melt adhesive for case forming and sealing applications.


    RIGID PACKAGING ADHESIVE

Product Description
-Thermogrip® H1714 is specifically designed to provide very low application temperatures (250°F to 275°F) while still providing fiber-tearing bonds over a wide temperature range on a variety of substrates.

Basic Uses-You can have confidence in the performance of H1714 in your process across a wide range of conditions and materials due to:
  • The Low Application Temperature Requirements of H1714-Up to 100F lower than conventional Hot melts. Cost savings in your process due to energy savings, increased equipment longevity, and decreased risk of severe burns by your operators.
  • The Extended Temperature Resistance of H1714-Provides fiber-tearing bonds over a wide temperature range on a variety of substrates.

  • The Excellent Adhesion of H1714-Adheres well to board with a wide range of recycled content as well as varnished, coated, and difficult substrates.

  • The Process Ease of H1714-
    • Clean running with little or no stringing.
    • Low application viscosity.
    • Excellent thermal stability and resistance to charring.
ADHESIVE PROPERTIES
Viscosity at 250°F:                1375 cP
Viscosity at 275°F:                  850 cP
Viscosity at 300°F:                  550 cP
Softening Point:                      164°F
Specific Gravity:                       98 g/cc
Suggested Running Temperature: 250°F to 300°F

For more information and/or to place an order Call 1-800-323-5158

 
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Call us at 1-800-323-5158
                        Last modified: January 17, 2012