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Meeting Customer expectations
and requirements is the main objective
of ISO 9001:2008
Customer Survey
We would appreciate your help so that we can provide
you with the very best in services. Your response will help us address the areas
of performance needing improvement.
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RIGID PACKAGING ADHESIVE
Product Thermogrip®
H1714 is a low application temperature hot melt
adhesive for case forming and sealing applications.
Product Description-Thermogrip®
H1714 is specifically designed to provide very low application temperatures
(250°F to 275°F) while still providing fiber-tearing bonds
over a wide temperature range on a variety of substrates.
Basic Uses-You can have
confidence in the performance of H1714 in your process across a wide range of
conditions and materials due to:
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The Low Application Temperature
Requirements of H1714-Up to 100F lower than conventional Hot
melts. Cost savings in your process due to energy savings, increased
equipment longevity, and decreased risk of severe burns by your
operators.
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The Extended Temperature
Resistance of H1714-Provides fiber-tearing bonds over a wide
temperature range on a variety of substrates.
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The Excellent Adhesion of H1714-Adheres
well to board with a wide range of recycled content as well as
varnished, coated, and difficult substrates.
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The Process Ease of H1714-
- Clean
running with little or no stringing.
- Low
application viscosity.
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Excellent thermal stability and resistance to charring.
ADHESIVE PROPERTIES
Viscosity at 250°F:
1375 cP
Viscosity at 275°F: 850 cP
Viscosity at 300°F: 550 cP
Softening Point: 164°F
Specific Gravity: 98 g/cc
Suggested Running Temperature: 250°F to 300°F
For more information and/or
to place an order Call 1-800-323-5158
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