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 Hysol
® 1C-LV
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Epoxy Adhesive |
Description
Dexter Hysol 1C-LV is a lower viscosity version of EPK 1C modified
for use in cartridges. Hysol 1C-LV is a general purpose adhesive
and sealant that bonds, seals and repairs a wide variety of materials.
Fully cured Hysol 1C-LV bonds offer superior thermal shock
resistance, mechanical, electrical and impact resistant properties and
low permeability to gases and vapors. The cured adhesive has good
dimensional stability and resistance to water, weather, oxygen, and
ozone, most petroleum products, mild acids and alkalis and many other
chemicals.
Recommended Substrates: Metals, wood, most
plastics, fiberglass, ceramic.
Features
High shock resistance
Room
temperature cure
Low permeability to gases and vapors
Extremely
low outgassing
Properties
Part
A
Part
B
Mixed
Color
White
Tan
Light
Tan
Viscosity, poise
620-1020
200-525
-
Handling
Mixing: This product is packaged in easy to use cartridges.
Follow mixing and application instructions below.
Part
A Part
B
By Volume
2
1
Application
Mixing - Cartridges: Place cartridge in proper
dispenser. To begin using new cartridge, remove cap and dispense a
small amount of adhesive, making sure both Part A and B are extruding.
Attach nozzle and dispense approximately 1-2" before
dispensing on to the part to be bonded. Partially used cartridges
should be stored with the mixing nozzle attached. To reuse, remove
and discard the old nozzle, attach new nozzle, and begin dispensing.
Application: Bonding surfaces should be clean and dry. For
optimum surface preparation, consult Dexter's Bulletin Preparing
the Surface for Adhesive Bonding. Once the adhesive is
applied, the bonded parts should be held in contact until the part has
developed handling strength. It is not necessary to clamp the
parts unless movement during cure is likely.
Cure: Complete cure is obtained after 3 days at room
temperature. After 24 hours, approximately 90% of full cure
properties are attained. When in a bonded joint, Hysol 1C-LV will
achieve handling strength in 4-6 hours at 77°F (note: this can very
with different bond configurations). Hysol 1C-LV can also be cured
with heat such as one hour at 180°F (82°C).
Clean Up: It is important to remove excess adhesive from
the work area before it hardens. Many common solvents and citrus
cleaners are suitable for removing uncured adhesive. Consult
with your supplier's information pertaining to the safe and proper use
of solvents.
Performance
Tensile Lap Shear Strength: Tested on etched aluminum
per ASTM D 1002
Cure
Test
Temp. °F Typical
Results, psi
1 Hour @ 180°F
77
2100
Bulk Properties
Hardness
(Shore D) 3-Day Cure @ 77°F:
75
minimum
Dielectric Strength, Volts/Mil
450
Tensile Strength, psi
2800
Elongation at Break, %
3.5
Pot Life @ 77°F (20 grams)
20
minutes
Coefficient of Thermal Expansion
35
x 10-6
Packaging
50 and 200 ml. EPS Cartridge
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DISCLAIMER: The
information supplied in this document is for guidance only and should
not be construed as a warranty. All implied warranties are
expressly disclaimed. Including without limitation any warranty of
merchantability and fitness for use: All users of the materials are
responsible for assuring that it is suitable for their needs,
environment and use. All data is subject to change as Dexter deems
appropriate.
Users should review the Material Safety Data Sheet (MSDS) and product
label for the material to determine possible health hazards, appropriate
engineering controls and precautions to be observed in using the
material. Copies of the MSDS and label are available upon request.
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